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heat-seal adhesive (<adhesive by form>, adhesive, ... Materials (hierarchy name)) |
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Note: A thermoplastic adhesive that is already present in a thin layer on the adherend which, by the application of heat and pressure, forms the bond. Distinguished from "hot-melt adhesive" which necessitates application of the adhesive in the molten state.
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| Terms: |
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| heat-seal adhesive (preferred,C,U,English-P,D,U,N)
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| heat-seal adhesives (C,U,English,AD,U,N)
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| adhesive, heat-seal (C,U,English,UF,U,N)
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| 熱壓膠黏劑 (C,U,Chinese (traditional)-P,D,U)
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| rè yā jiāo nián jì (C,U,Chinese (transliterated Hanyu Pinyin)-P,UF,U)
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| re ya jiao nian ji (C,U,Chinese (transliterated Pinyin without tones)-P,UF,U)
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| je ya chiao nien chi (C,U,Chinese (transliterated Wade-Giles)-P,UF,U)
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| thermoplastisch hechtmiddel (C,U,Dutch-P,D,U,U)
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| adhesivo de sellado por calor (C,U,Spanish-P,D,U,N)
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| adhesivos de sellado por calor (C,U,Spanish,AD,U,N)
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Facet/Hierarchy Code: M.MT |
Hierarchical Position:
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Materials Facet |
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.... Materials (hierarchy name) (G) |
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........ materials (substances) (G) |
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............ <materials by function> (G) |
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................ adhesive (G) |
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.................... <adhesive by form> (G) |
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........................ heat-seal adhesive (G) |
Additional Notes: |
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| Chinese (traditional) ..... 一種熱塑性的膠黏劑，已塗有薄層在待膠接物上，可運用熱及壓力產生黏接。與「熱熔膠黏劑」並不相同，後者需要運用熔解狀態的膠黏劑來黏接。 |
| Dutch ..... Een thermoplastisch hechtmiddel dat al in een dunne laag op het te plakken oppervlak aanwezig is waar het, door aanwending van warmte en druk, de binding vormt. Te onderscheiden van 'smeltlijm' waarbij het hechtmiddel moet worden aangebracht in gesmolten toestand. |
| Spanish ..... Adhesivo termoplástico que se encuentra previamente presente como capa delgada sobre el adherente el cual, por aplicación de calor y presión, forma la unión. Se distingue del "adhesivo termofusionable", que necesita aplicación del adhesivo en estado fundido. |
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Related concepts: |
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| distinguished from .... |
hot-melt adhesive |
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(<adhesive by form>, adhesive, ... Materials (hierarchy name)) [300212571] |
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Sources and Contributors: |
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