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plasma-enhanced chemical vapor deposition (coating (process), <surface covering processes and techniques>, ... Processes and Techniques (hierarchy name)) |
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Note: A chemical vapor deposition process used to deposit a single thin layer (thickness less than 20 micrometer) or multiple thin layers of materials in a gas state (vapor) to a solid state over a substrate. In PECVD, deposition is achieved by introducing reactant gases between parallel electrodes—a grounded electrode and an RF (Radio Frequency)-energized electrode. The capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. In conservation, PECVD has been used for protection or surface modification of metallic artifacts.
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| Terms: |
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| plasma-enhanced chemical vapor deposition (preferred,C,U,English-P,D,U,U)
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| plasma enhanced chemical vapor deposition (C,U,English,UF,U,U)
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| PECVD (C,U,A,English,UF,U,U)
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Facet/Hierarchy Code: K.KT |
Hierarchical Position:
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Activities Facet |
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.... Processes and Techniques (hierarchy name) (G) |
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........ <processes and techniques by specific type> (G) |
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............ <additive and joining processes and techniques> (G) |
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................ <surface covering processes and techniques> (G) |
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.................... coating (process) (G) |
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........................ plasma-enhanced chemical vapor deposition (G) |
Sources and Contributors: |
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| plasma enhanced chemical vapor deposition............ |
[GCI, VP] |
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AATA online (2020-) 2019-144796 |
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